NXP Semiconductor has announced the launch of the RF transceiver TEF510X to support global car-to-X communication (C2X). This is the second of NXP’s RoadLINK products, billed as a way to add wireless to cars with a single chip.
No wireless communication system design is needed, NXP claims, because the TEF510x provides full 802.11p functionality on a chip, enabling automotive OEMs to develop C2X without implementing a design for wireless communication. Together with the NXP/Cohda Wireless SAF510x baseband processor, powered by software-defined radio technology, the RoadLINK chip is billed as providing fast, accurate, and reliable communication to and from the vehicle.
NXP designed the chip to provide OEMs with an optimized solution to meet 802.11p modem functionality on one chip. The chip has the flexibility to support global deployments and various system configurations.
Thomas Hinz, senior product marketing manager, RoadLINK, NXP Semiconductors, said in a press release:
“Our chips enable OEMs to utilize a unique software-defined radio approach, to deploy global solutions based on a single hardware platform with end-of-line configurability… It’s the only solution that has been field proven in simTD and Safety Pilot, and which easily exceeds all of emerging Car-to-Car minimum performance requirements. It’s fast, it works over extended distances, and it has the features to fully realize the potential of C2X technology”.
The NXP TEF510x RF transceiver meets Japanese 760 MHz V2X requirements, USA and European (5.9 GHz), as well as WiFi and DSRC (dedicated short-range communications) 5.8 GHz specifications. It will be released for automotive production in 2015 and is expected to be available to consumers as early as 2016.